{"id":55130,"date":"2025-11-11T15:54:41","date_gmt":"2025-11-11T20:54:41","guid":{"rendered":"https:\/\/engineering.jhu.edu\/magazine\/?p=55130"},"modified":"2026-06-11T15:48:09","modified_gmt":"2026-06-11T19:48:09","slug":"microchips-major-vision","status":"publish","type":"post","link":"https:\/\/engineering.jhu.edu\/magazine\/inquiring-minds\/change-agents\/microchips-major-vision\/","title":{"rendered":"Microchips, Major Vision"},"content":{"rendered":"\n<p>While his kindergarten contemporaries were stacking Lego bricks, Jacob Heisler was building electronics. With one grandfather working in the energy industry and the other for IBM, technology was in his blood. \u201cBetween the two of them, they had me building a lot of circuits and learning how to solder,\u201d remembers Heisler. Those early skills stuck with him, leading to his first job at age 12 in his family\u2019s microelectronics manufacturing business in York, Pennsylvania\u2014a role he grew into over the years, ultimately serving as the company\u2019s engineering manager until 2024.<\/p>\n\n\n\n<p>Now a student in <a href=\"https:\/\/ep.jhu.edu\/\" target=\"_blank\" rel=\"noreferrer noopener\">Johns Hopkins\u2019 Engineering for Professionals program<\/a>, Heisler is pursuing a master\u2019s degree in electrical engineering with a focus on solid-state devices. At the same time, he is running his own venture: Heisler Semiconductor, a prototyping and design for manufacturing firm he launched in July 2024. Early support from his University of Maryland professors and UMBC\u2019s SCALEUP Maryland accelerator proved critical, with both institutions becoming some of his first customers. In just over a year, the company has earned the trust of universities, startups, and military contractors, bringing in about $20,000 in monthly sales.<\/p>\n\n\n\n<p>\u201cThe average person interacts with 1,000 semiconductors every day without realizing it,\u201d Heisler explains. Semiconductors\u2014 materials like silicon\u2014allow electricity to be controlled with extreme precision, making them the foundation of microchips that power everything from smartphones to solar panels.<\/p>\n\n\n\n<p>Much of the U.S. semiconductor industry was outsourced overseas in the 1980s, particularly to Taiwan and other parts of Southeast Asia. Recent legislation, including the CHIPS and Science Act, aims to bring more manufacturing back to the U.S. But large West Coast firms dominate the market, leaving smaller companies needing microchips underserved.<\/p>\n\n\n\n<p>\u201cWe work with universities and startups that need niche, one-off prototypes. If that one sample doesn\u2019t function, their budget is gone and the project ends,\u201d says Heisler. \u201cA lot of organizations wouldn\u2019t put in the care and effort needed to make these products successful.\u201d He says Heisler Semiconductor differentiates itself by offering hands-on partnerships, competitive pricing, and integration into clients\u2019 supply chains, ensuring a smooth transition from prototype to production. The approach has already garnered repeat business, from companies designing products ranging from communications systems to wearable medical devices and virtual reality goggles.<\/p>\n\n\n\n<p>Despite his technical background, Heisler knew he needed to strengthen his business skills. At the suggestion of Megan Howie, Johns Hopkins Engineering\u2019s senior associate dean of corporate and global partnerships, he applied to the <a href=\"https:\/\/pavacenter.jhu.edu\/\" target=\"_blank\" rel=\"noreferrer noopener\">Pava Marie LaPere Center for Entrepreneurship\u2019s<\/a> <a href=\"https:\/\/pavacenter.jhu.edu\/programs\/student-programs\/fuel\/\" target=\"_blank\" rel=\"noreferrer noopener\">Fuel program<\/a>, a venture accelerator for student entrepreneurs, designed to help committed ventures get market\/investor ready. The program provided training, networking, and mentoring from legal and financial experts, helping Heisler hone critical skills just a few months after Heisler Semiconductor\u2019s launch.<\/p>\n\n\n\n<p>\u201cWe worked closely with Jacob on refining his storytelling and improving his business plan,\u201d says <a href=\"https:\/\/pavacenter.jhu.edu\/our-team\/\" target=\"_blank\" rel=\"noreferrer noopener\">Paul Davidson<\/a>, the Pava Center\u2019s associate director. \u201cJacob started the cohort with strong product and technical experiences, but in order to grow, founders must help customers and investors understand why Heisler can provide the best solutions to their needs.\u201d<\/p>\n\n\n\n<p>Perhaps the program\u2019s biggest benefit was helping Heisler build a team. After the offshoring of semiconductor knowledge decades ago, the last remaining industry professionals in the U.S. are now retiring, leaving an inexperienced workforce to take up the reins. Today, four of Heisler Semiconductor\u2019s employees are Johns Hopkins students. \u201cI\u2019m creating a talent pipeline from Hopkins and other universities to help close the knowledge gap\u2014especially here on the East Coast,\u201d he says.<\/p>\n\n\n\n<p>Davidson agrees. \u201cThere is enormous potential in the Baltimore\u2013D.C. region for Jacob\u2019s venture to support government, university, and industry innovation. We look forward to continuing to support his growth.\u201d<\/p>\n\n\n\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\">\n<p>\u201cI\u2019m creating a talent pipeline from Hopkins and other universities to help close the knowledge gap\u2014especially here on the East Coast.\u201d\u2014Jacob Heisler<\/p>\n<\/blockquote>\n\n\n\n<p>Looking ahead, Heisler Semiconductor is developing its flagship technology: 3D chip stacking. \u201cMost chips today are arranged on a flat, 2D plane,\u201d Heisler explains. \u201cStacking them vertically allows for smaller devices with greater computing power.\u201d While large manufacturers have invested heavily in this approach, mid- and low-volume producers can\u2019t access it at scale. \u201cThat\u2019s the gap we\u2019re trying to fill.\u201d<\/p>\n\n\n\n<p>\u2014 ERIN P. LEWIS<\/p>\n\n\n\n<p><em>Illustration by Aaron Lowell Denton<\/em><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Jacob Heisler is pursuing a master\u2019s degree in electrical engineering with a focus on solid-state devices. At the same time, he is running his own venture: Heisler Semiconductor.<\/p>\n","protected":false},"author":3,"featured_media":55133,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[68],"tags":[],"issue":[104],"class_list":["post-55130","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-change-agents","issue-fall-2025"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Microchips, Major Vision - Johns Hopkins Engineering Magazine<\/title>\n<meta name=\"description\" content=\"Jacob Heisler is pursuing a master\u2019s degree in electrical engineering with a focus on solid-state devices. At the same time, he is running his own venture: Heisler Semiconductor.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/engineering.jhu.edu\/magazine\/inquiring-minds\/change-agents\/microchips-major-vision\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Microchips, Major Vision - Johns Hopkins Engineering Magazine\" \/>\n<meta property=\"og:description\" content=\"Jacob Heisler is pursuing a master\u2019s degree in electrical engineering with a focus on solid-state devices. At the same time, he is running his own venture: Heisler Semiconductor.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/engineering.jhu.edu\/magazine\/inquiring-minds\/change-agents\/microchips-major-vision\/\" \/>\n<meta property=\"og:site_name\" content=\"Johns Hopkins Engineering Magazine\" \/>\n<meta property=\"article:published_time\" content=\"2025-11-11T20:54:41+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2026-06-11T19:48:09+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/engineering.jhu.edu\/magazine\/wp-content\/uploads\/2025\/11\/2-Johns-Hopkins-Engineering-Magazine-Microchips-Major-Visions-1024x910.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"1024\" \/>\n\t<meta property=\"og:image:height\" content=\"910\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Steve James\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"4 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/engineering.jhu.edu\\\/magazine\\\/inquiring-minds\\\/change-agents\\\/microchips-major-vision\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/engineering.jhu.edu\\\/magazine\\\/inquiring-minds\\\/change-agents\\\/microchips-major-vision\\\/\"},\"author\":{\"name\":\"Steve James\",\"@id\":\"https:\\\/\\\/engineering.jhu.edu\\\/magazine\\\/#\\\/schema\\\/person\\\/3788853b9a1c54c0d88281b9a5671fec\"},\"headline\":\"Microchips, Major Vision\",\"datePublished\":\"2025-11-11T20:54:41+00:00\",\"dateModified\":\"2026-06-11T19:48:09+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/engineering.jhu.edu\\\/magazine\\\/inquiring-minds\\\/change-agents\\\/microchips-major-vision\\\/\"},\"wordCount\":724,\"publisher\":{\"@id\":\"https:\\\/\\\/engineering.jhu.edu\\\/magazine\\\/#organization\"},\"image\":{\"@id\":\"https:\\\/\\\/engineering.jhu.edu\\\/magazine\\\/inquiring-minds\\\/change-agents\\\/microchips-major-vision\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/engineering.jhu.edu\\\/magazine\\\/wp-content\\\/uploads\\\/2025\\\/11\\\/2-Johns-Hopkins-Engineering-Magazine-Microchips-Major-Visions.jpg\",\"articleSection\":[\"Change Agents\"],\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/engineering.jhu.edu\\\/magazine\\\/inquiring-minds\\\/change-agents\\\/microchips-major-vision\\\/\",\"url\":\"https:\\\/\\\/engineering.jhu.edu\\\/magazine\\\/inquiring-minds\\\/change-agents\\\/microchips-major-vision\\\/\",\"name\":\"Microchips, Major Vision - Johns Hopkins Engineering Magazine\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/engineering.jhu.edu\\\/magazine\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/engineering.jhu.edu\\\/magazine\\\/inquiring-minds\\\/change-agents\\\/microchips-major-vision\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/engineering.jhu.edu\\\/magazine\\\/inquiring-minds\\\/change-agents\\\/microchips-major-vision\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/engineering.jhu.edu\\\/magazine\\\/wp-content\\\/uploads\\\/2025\\\/11\\\/2-Johns-Hopkins-Engineering-Magazine-Microchips-Major-Visions.jpg\",\"datePublished\":\"2025-11-11T20:54:41+00:00\",\"dateModified\":\"2026-06-11T19:48:09+00:00\",\"description\":\"Jacob Heisler is pursuing a master\u2019s degree in electrical engineering with a focus on solid-state devices. At the same time, he is running his own venture: Heisler Semiconductor.\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/engineering.jhu.edu\\\/magazine\\\/inquiring-minds\\\/change-agents\\\/microchips-major-vision\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/engineering.jhu.edu\\\/magazine\\\/inquiring-minds\\\/change-agents\\\/microchips-major-vision\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/engineering.jhu.edu\\\/magazine\\\/inquiring-minds\\\/change-agents\\\/microchips-major-vision\\\/#primaryimage\",\"url\":\"https:\\\/\\\/engineering.jhu.edu\\\/magazine\\\/wp-content\\\/uploads\\\/2025\\\/11\\\/2-Johns-Hopkins-Engineering-Magazine-Microchips-Major-Visions.jpg\",\"contentUrl\":\"https:\\\/\\\/engineering.jhu.edu\\\/magazine\\\/wp-content\\\/uploads\\\/2025\\\/11\\\/2-Johns-Hopkins-Engineering-Magazine-Microchips-Major-Visions.jpg\",\"width\":1688,\"height\":1500},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/engineering.jhu.edu\\\/magazine\\\/inquiring-minds\\\/change-agents\\\/microchips-major-vision\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/engineering.jhu.edu\\\/magazine\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Microchips, Major Vision\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/engineering.jhu.edu\\\/magazine\\\/#website\",\"url\":\"https:\\\/\\\/engineering.jhu.edu\\\/magazine\\\/\",\"name\":\"Johns Hopkins Engineering Magazine\",\"description\":\"\",\"publisher\":{\"@id\":\"https:\\\/\\\/engineering.jhu.edu\\\/magazine\\\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/engineering.jhu.edu\\\/magazine\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/engineering.jhu.edu\\\/magazine\\\/#organization\",\"name\":\"Johns Hopkins Engineering Magazine\",\"url\":\"https:\\\/\\\/engineering.jhu.edu\\\/magazine\\\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/engineering.jhu.edu\\\/magazine\\\/#\\\/schema\\\/logo\\\/image\\\/\",\"url\":\"https:\\\/\\\/engineering.jhu.edu\\\/magazine\\\/wp-content\\\/uploads\\\/2026\\\/06\\\/Spring2026_logo.jpg\",\"contentUrl\":\"https:\\\/\\\/engineering.jhu.edu\\\/magazine\\\/wp-content\\\/uploads\\\/2026\\\/06\\\/Spring2026_logo.jpg\",\"width\":820,\"height\":694,\"caption\":\"Johns Hopkins Engineering Magazine\"},\"image\":{\"@id\":\"https:\\\/\\\/engineering.jhu.edu\\\/magazine\\\/#\\\/schema\\\/logo\\\/image\\\/\"}},{\"@type\":\"Person\",\"@id\":\"https:\\\/\\\/engineering.jhu.edu\\\/magazine\\\/#\\\/schema\\\/person\\\/3788853b9a1c54c0d88281b9a5671fec\",\"name\":\"Steve James\",\"url\":\"https:\\\/\\\/engineering.jhu.edu\\\/magazine\\\/author\\\/sjames52\\\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Microchips, Major Vision - Johns Hopkins Engineering Magazine","description":"Jacob Heisler is pursuing a master\u2019s degree in electrical engineering with a focus on solid-state devices. At the same time, he is running his own venture: Heisler Semiconductor.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/engineering.jhu.edu\/magazine\/inquiring-minds\/change-agents\/microchips-major-vision\/","og_locale":"en_US","og_type":"article","og_title":"Microchips, Major Vision - Johns Hopkins Engineering Magazine","og_description":"Jacob Heisler is pursuing a master\u2019s degree in electrical engineering with a focus on solid-state devices. At the same time, he is running his own venture: Heisler Semiconductor.","og_url":"https:\/\/engineering.jhu.edu\/magazine\/inquiring-minds\/change-agents\/microchips-major-vision\/","og_site_name":"Johns Hopkins Engineering Magazine","article_published_time":"2025-11-11T20:54:41+00:00","article_modified_time":"2026-06-11T19:48:09+00:00","og_image":[{"width":1024,"height":910,"url":"https:\/\/engineering.jhu.edu\/magazine\/wp-content\/uploads\/2025\/11\/2-Johns-Hopkins-Engineering-Magazine-Microchips-Major-Visions-1024x910.jpg","type":"image\/jpeg"}],"twitter_card":"summary_large_image","twitter_misc":{"Written by":"Steve James","Est. reading time":"4 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/engineering.jhu.edu\/magazine\/inquiring-minds\/change-agents\/microchips-major-vision\/#article","isPartOf":{"@id":"https:\/\/engineering.jhu.edu\/magazine\/inquiring-minds\/change-agents\/microchips-major-vision\/"},"author":{"name":"Steve James","@id":"https:\/\/engineering.jhu.edu\/magazine\/#\/schema\/person\/3788853b9a1c54c0d88281b9a5671fec"},"headline":"Microchips, Major Vision","datePublished":"2025-11-11T20:54:41+00:00","dateModified":"2026-06-11T19:48:09+00:00","mainEntityOfPage":{"@id":"https:\/\/engineering.jhu.edu\/magazine\/inquiring-minds\/change-agents\/microchips-major-vision\/"},"wordCount":724,"publisher":{"@id":"https:\/\/engineering.jhu.edu\/magazine\/#organization"},"image":{"@id":"https:\/\/engineering.jhu.edu\/magazine\/inquiring-minds\/change-agents\/microchips-major-vision\/#primaryimage"},"thumbnailUrl":"https:\/\/engineering.jhu.edu\/magazine\/wp-content\/uploads\/2025\/11\/2-Johns-Hopkins-Engineering-Magazine-Microchips-Major-Visions.jpg","articleSection":["Change Agents"],"inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/engineering.jhu.edu\/magazine\/inquiring-minds\/change-agents\/microchips-major-vision\/","url":"https:\/\/engineering.jhu.edu\/magazine\/inquiring-minds\/change-agents\/microchips-major-vision\/","name":"Microchips, Major Vision - Johns Hopkins Engineering Magazine","isPartOf":{"@id":"https:\/\/engineering.jhu.edu\/magazine\/#website"},"primaryImageOfPage":{"@id":"https:\/\/engineering.jhu.edu\/magazine\/inquiring-minds\/change-agents\/microchips-major-vision\/#primaryimage"},"image":{"@id":"https:\/\/engineering.jhu.edu\/magazine\/inquiring-minds\/change-agents\/microchips-major-vision\/#primaryimage"},"thumbnailUrl":"https:\/\/engineering.jhu.edu\/magazine\/wp-content\/uploads\/2025\/11\/2-Johns-Hopkins-Engineering-Magazine-Microchips-Major-Visions.jpg","datePublished":"2025-11-11T20:54:41+00:00","dateModified":"2026-06-11T19:48:09+00:00","description":"Jacob Heisler is pursuing a master\u2019s degree in electrical engineering with a focus on solid-state devices. At the same time, he is running his own venture: Heisler Semiconductor.","breadcrumb":{"@id":"https:\/\/engineering.jhu.edu\/magazine\/inquiring-minds\/change-agents\/microchips-major-vision\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/engineering.jhu.edu\/magazine\/inquiring-minds\/change-agents\/microchips-major-vision\/"]}]},{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/engineering.jhu.edu\/magazine\/inquiring-minds\/change-agents\/microchips-major-vision\/#primaryimage","url":"https:\/\/engineering.jhu.edu\/magazine\/wp-content\/uploads\/2025\/11\/2-Johns-Hopkins-Engineering-Magazine-Microchips-Major-Visions.jpg","contentUrl":"https:\/\/engineering.jhu.edu\/magazine\/wp-content\/uploads\/2025\/11\/2-Johns-Hopkins-Engineering-Magazine-Microchips-Major-Visions.jpg","width":1688,"height":1500},{"@type":"BreadcrumbList","@id":"https:\/\/engineering.jhu.edu\/magazine\/inquiring-minds\/change-agents\/microchips-major-vision\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/engineering.jhu.edu\/magazine\/"},{"@type":"ListItem","position":2,"name":"Microchips, Major Vision"}]},{"@type":"WebSite","@id":"https:\/\/engineering.jhu.edu\/magazine\/#website","url":"https:\/\/engineering.jhu.edu\/magazine\/","name":"Johns Hopkins Engineering Magazine","description":"","publisher":{"@id":"https:\/\/engineering.jhu.edu\/magazine\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/engineering.jhu.edu\/magazine\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/engineering.jhu.edu\/magazine\/#organization","name":"Johns Hopkins Engineering Magazine","url":"https:\/\/engineering.jhu.edu\/magazine\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/engineering.jhu.edu\/magazine\/#\/schema\/logo\/image\/","url":"https:\/\/engineering.jhu.edu\/magazine\/wp-content\/uploads\/2026\/06\/Spring2026_logo.jpg","contentUrl":"https:\/\/engineering.jhu.edu\/magazine\/wp-content\/uploads\/2026\/06\/Spring2026_logo.jpg","width":820,"height":694,"caption":"Johns Hopkins Engineering Magazine"},"image":{"@id":"https:\/\/engineering.jhu.edu\/magazine\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"https:\/\/engineering.jhu.edu\/magazine\/#\/schema\/person\/3788853b9a1c54c0d88281b9a5671fec","name":"Steve James","url":"https:\/\/engineering.jhu.edu\/magazine\/author\/sjames52\/"}]}},"_links":{"self":[{"href":"https:\/\/engineering.jhu.edu\/magazine\/wp-json\/wp\/v2\/posts\/55130","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/engineering.jhu.edu\/magazine\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/engineering.jhu.edu\/magazine\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/engineering.jhu.edu\/magazine\/wp-json\/wp\/v2\/users\/3"}],"replies":[{"embeddable":true,"href":"https:\/\/engineering.jhu.edu\/magazine\/wp-json\/wp\/v2\/comments?post=55130"}],"version-history":[{"count":7,"href":"https:\/\/engineering.jhu.edu\/magazine\/wp-json\/wp\/v2\/posts\/55130\/revisions"}],"predecessor-version":[{"id":57798,"href":"https:\/\/engineering.jhu.edu\/magazine\/wp-json\/wp\/v2\/posts\/55130\/revisions\/57798"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/engineering.jhu.edu\/magazine\/wp-json\/wp\/v2\/media\/55133"}],"wp:attachment":[{"href":"https:\/\/engineering.jhu.edu\/magazine\/wp-json\/wp\/v2\/media?parent=55130"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/engineering.jhu.edu\/magazine\/wp-json\/wp\/v2\/categories?post=55130"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/engineering.jhu.edu\/magazine\/wp-json\/wp\/v2\/tags?post=55130"},{"taxonomy":"issue","embeddable":true,"href":"https:\/\/engineering.jhu.edu\/magazine\/wp-json\/wp\/v2\/issue?post=55130"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}